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Multilayer PCB Prototyping Services

Multilayer PCB Prototyping Services — 4–12 Layer Quick-Turn Prototypes

Multilayer PCB Prototyping Services — Fast, Reliable 4–12 Layer Prototypes

Need high-quality multilayer prototypes on a predictable schedule? Our multilayer PCB prototyping services deliver quick-turn and low-volume runs with full HDI, microvia and controlled-impedance support. Upload Gerbers for a confirmed lead time and instant quote.

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Quick summary — what you get

  • Support for 4–12 layer prototypes with HDI, blind/buried vias and via-in-pad.

  • Predictable quick-turn tiers and a representative lead-time matrix for planning.

  • Full turnkey: BOM sourcing, part substitution, AOI/X-ray/ICT testing and FAI reporting.

  • DFM review, stackup templates, and NPI support to move from prototype to pilot production.

Qingjian Electronic multilayer capabilities

We prototype multilayer boards across a wide range of technologies and use cases — from 4-layer controlled-impedance boards for high-speed equipment to 12-layer HDI stackups for compact products.

Technical highlights:
  • Layer count: 4 to 12 layers (typical quick-turn: 4–6 layers)

  • Minimum trace/space: down to 3–4 mil (process-dependent)

  • Via support: through-hole, blind/buried vias, microvias & laser vias

  • Via-in-pad: copper fill & planarization for BGA pads

  • Copper weight: 0.5 oz – heavy copper up to 6 oz (per layer options)

  • Materials: FR-4 standard, high-TG, Rogers and other HF substrates

  • Surface finishes: ENIG, HASL, OSP, immersion silver

  • Board size / thickness: up to 450mm × 450mm; thickness 0.4–3.2mm



Typical lead times & quick-turn tiers

Use the matrix below to estimate turnaround. Final lead time is confirmed after Gerber/BOM review and depends on parts availability and testing requirements.

Representative multilayer PCB prototyping lead time matrix
Board TypeQtyQuick-turn (typical)Standard
4-layer, standard FR-41–103–5 business days7–12 business days
6-layer, controlled impedance1–205–8 business days10–15 business days
8-layer HDI with microvias1–507–12 business days12–20 business days
10–12 layer rigid-flex / heavy copper1–5010–15 business days15–25 business days

Note: These are representative estimates. If you need guaranteed SLA lead times for a program, request a locked schedule during quoting.

How we manufacture multilayer prototypes

Our multilayer process follows strict controls to ensure stackup accuracy and yield:

  1. Stackup design & prep: engineer-verified stackups and impedance targets with test coupons.

  2. Lamination: controlled lamination cycles for multilayer bonding and reliability.

  3. Drilling & plating: mechanical & laser drilling for microvias; uniform plating to spec.

  4. Imaging & etch: precise inner/outer layer imaging and etching control.

  5. Surface finish & routing: finish selection, routing and edge profiling.

  6. Assembly & test: SMT assembly, AOI, 3D X-ray for BGAs, ICT/flying-probe and functional testing.

Design for Manufacturability (DFM) for multilayer boards

Following DFM best practices reduces rework and shortens prototype lead time. Download our free DFM checklist and stackup templates to accelerate quoting and production.


Top DFM tips

  • Provide a complete Gerber set (or ODB++/IPC2581) and a BOM with manufacturer part numbers.

  • Include a clear stackup, controlled impedance targets and a PCB fabrication drawing.

  • Avoid excessive via-in-pad unless using filled & planarized processes; declare BGAs and critical components.

  • Group similar variants to share tooling and reduce per-board cost.

High-speed design & controlled impedance

We provide impedance modeling, coupon measurement (TDR) and validated stackups for high-speed designs. Typical services include target impedance calculation, test coupon fabrication and verification reports to ensure signal integrity for DDR, USB, RF and high-speed SerDes interfaces.

Assembly & quality assurance

Our multilayer assembly & test capabilities include:

  • SMT placement down to 01005 and 0201 components

  • Fine-pitch BGA & microBGA handling, reflow profile optimization

  • AOI (2D/3D), 3D X-ray inspection, ICT and flying-probe testing

  • Functional test fixture development and FAI reporting with traceability

Turnkey services & component sourcing

We offer end-to-end turnkey prototyping: BOM sourcing, procurement of long-lead items, authorized part substitution, kitting and global DDP shipping. For startup projects we provide sourcing recommendations to meet cost and lead-time targets.

Learn more about our component sourcing

From prototype to NPI & low-volume production

We help customers scale prototypes into pilot runs by optimizing panelization, test coverage and cost-of-goods. Recommendations include pilot run sizing, yield analysis and production transfer plans to minimize surprises at scale.

Representative case studies

Medical telemetry module — 6-layer controlled impedance

Challenge: tight impedance tolerance and small form factor. Solution: validated stackup, TDR verification and 10-pc quick-turn prototype delivered in 7 days. Result: passed EMC pre-tests and reduced rework by 30%.

Industrial controller — 8-layer HDI

Challenge: dense BGA layout. Solution: microvia HDI process with via-in-pad fill and 3D X-ray inspection. Result: pilot run of 50 pcs delivered with 98.5% first-pass yield.

Pricing models & request an instant quote

Prototype pricing varies by layer count, board area, special materials and test requirements. Typical sample prices (illustrative): 4-layer prototype (1–5 pcs) — $120–$280; 6-layer prototype (1–10 pcs) — $240–$600; 8-layer HDI (1–20 pcs) — $420–$1200. Get an exact quote by uploading Gerbers and BOM.


Certifications & equipment

We maintain ISO-aligned quality systems and invest in modern equipment to support multilayer prototyping.

FAQ — Multilayer PCB prototyping services

Q: What layer counts do you prototype?

A: We prototype 4–12 layer boards. Quick-turn tiers are fastest for 4–6 layers; 8+ layers typically require longer lamination cycles.

Q: How can I speed up lead time for a multilayer prototype?

A: Provide a complete Gerber/BOM package, choose standard materials, pre-approve substitute parts and request our free DFM review at submission.

Q: Do you measure impedance for multilayer PCBs?

A: Yes — we provide impedance coupon fabrication and TDR verification as part of controlled-impedance services.

Ready to prototype your multilayer PCB?

Upload your Gerbers and BOM now and get a confirmed lead time and transparent price. Our team will run a free DFM review and return a locked schedule with recommended quick-turn tier.

Request Instant Quote Contact Sales

Multilayer PCB Prototyping Services

Ready to prototype your multilayer PCB?

Upload your Gerbers and BOM now and get a confirmed lead time and transparent price. Our team will run a free DFM review and return a locked schedule with recommended quick-turn tier.

Request Instant Quote Contact Sales


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