PCBA processing
● 2260 square meters of SMT production workshop
● ISO9001 QUALITY MANAGEMENT SYSTEM
● ISO13485 QUALITY MANAGEMENT SYSTEM
● IATF16949 QUALITY MANAGEMENT SYSTEM
We have 5 SMT (Surface Mount Technology) production lines equipped with brand-new imported Samsung S1 and S2 high-speed placement machines, fully automatic solder paste printing machines, ERSA ten-temperature zone reflow ovens, AOI (Automated Optical Inspection), SPI (Surface Mount Inspection), X-RAY, and other high-end equipment. We are particularly skilled in producing high-precision and complex single boards, and have actual performance in producing ultra-complex single boards. We can mount SMD (Surface Mount Devices) components including 0201 and 01005, as well as ultra-high-precision QFP and BGA chips with a pin pitch of 0.3mm. For specific details, please refer to the "Professional PCBA" section mentioned above.
China Turnkey PCB Assembly Services
One-Stop Electronic Manufacturing Solutions from Shenzhen Qingjian Electronic Technology Co., Ltd.
Looking for a reliable turnkey PCB assembly service provider in China? Shenzhen Qingjian Electronic Technology Co., Ltd., a wholly-owned subsidiary of Bangyan Technology Co., Ltd., delivers comprehensive one-stop EMS (Electronics Manufacturing Services) that take your product from concept to completion.
With over 15 years of manufacturing experience and cutting-edge facilities, we are your trusted partner for turnkey PCB assembly.
What is Turnkey PCB Assembly?
Turnkey PCB Assembly is an all-in-one service that manages every stage of your PCB production lifecycle—from:
SMT Assembly
Final Product Testing
With a turnkey partner like Qingjian Electronics, you save time, reduce costs, and avoid the complexities of coordinating with multiple vendors.
Our Turnkey Capabilities
PCB Design & Engineering Support
Our expert team can assist in PCB layout, stack-up optimization, and DFM/DFT reviews, ensuring high-quality manufacturing from the very beginning.
PCB Fabrication
We offer quick-turn and high-volume multilayer PCB manufacturing (1–32 layers), using materials such as:
FR4
Rogers
Aluminum
HDI
Other specialty materials
Component Sourcing
With a robust supply chain network and strategic partnerships with global distributors like Digi-Key, Mouser, and Arrow, we provide cost-effective and authentic electronic components.
We support both consigned and full turnkey sourcing models.
SMT & DIP Assembly
Equipped with Samsung high-speed placement machines and ERSA reflow/wave soldering systems, we handle:
0201/01005 SMD parts
BGA, QFN, QFP with 0.3mm pitch
Double-sided SMT
DIP plug-in and selective soldering
Functional Testing & Aging
We provide 100% inspection services, including:
AOI (2D/3D)
X-ray for BGA solder joints
ICT/FCT
Burn-in/Aging test
Blue Eye First Article Inspection
Final Product Assembly
We handle complete box build services, including:
Enclosure manufacturing
Cable and harness assembly
Firmware flashing and calibration
Final testing and packaging
Why Choose Qingjian Electronics?
End-to-End Manufacturing Experience
MES-Driven Smart Factory
Certified Quality (ISO9001, RoHS, IPC-A-610)
Flexible Order Volumes
Global Customer Base
Founded in 2008
Qingjian Electronics has evolved into a full-spectrum EMS provider with more than 2260 sqm of workshop area and a highly integrated supply chain.
MES-Driven Smart Factory
We operate with a state-of-the-art Manufacturing Execution System (MES) to achieve real-time process traceability, production efficiency, and consistent quality.
Certified Quality
We strictly follow ISO9001 quality management standards and adhere to RoHS, IPC-A-610, and other industry certifications.
Flexible Order Volumes
We support prototypes, small-to-medium batches, and mass production — ideal for startups and established OEMs alike.
Global Customer Base
Our products serve diverse industries such as:
Telecom & Networking
Medical Electronics
Automotive Electronics
Industrial Control Systems
Smart Home Devices
Security & Surveillance
Consumer Electronics
Industries We Serve
| Industry | Application Examples |
|---|---|
| Medical | Patient monitors, diagnostic equipment |
| Automotive | ECU boards, dashboard electronics |
| Industrial Control | PLCs, sensor hubs, automation controllers |
| Communication | Routers, base stations, IoT modules |
| Consumer Electronics | Smart wearables, Bluetooth devices, LED drivers |
| Security | CCTV, access control systems |
Fast Turnaround, Competitive Cost, Trusted Quality
At Qingjian Electronics, our focus is on delivering results—on time and on budget.
Whether you're launching a new product or scaling up production, we ensure seamless coordination, transparent communication, and agile support throughout your project lifecycle.
PCBA Production Capacity
| Daily production capacity of SMT | 4 million points | |
| SMT production line | 5 items | |
| Material throwing rate | Specific resistance 0.3% | |
| IC type without material throwing | ||
| Single board type | POP/Regular Board/FPC/Rigid-Flex Board/Metal Substrate | |
| Specification of mounted components | Minimum package size for attachment | 01005 Chip/0.4 Pitch BGA |
| Minimum device precision | ±0.04mm | |
| IC-type chip placement accuracy | ±0.03mm | |
| Mounting PCB specifications | PCB size | 50*50mm - 610*510mm |
| PCB thickness | 0.3-6.5mm | |
| Process flow and capacity | 1. Hold an order review meeting before the product is launched to provide early warning of potential issues and propose solutions. | |
| 2. Evaluate the requirements for the development of steel mesh fixtures and implement reverse control to prevent supplier defects. | ||
| 3. The process engineer shall fully cooperate with production to address process anomalies. | ||
| 4. For unreasonable customer designs, we will provide a corresponding summary report of trial production issues to assist customers in optimizing their designs. | ||
| Quality control capability | 1. Intelligent first article inspection device | Detecting incorrect materials, missing parts, polarity, direction, silk-screening, etc., it is primarily applied to the inspection of the first piece. Compared to manual inspection, it offers higher accuracy and a speed increase of over 50%. |
| 2.SPI-Fully automatic 3D solder paste thickness gauge | Detect various quality issues in solder paste printing, such as missing printing, insufficient solder, excessive solder, continuous solder, misalignment, poor shape, and board surface contamination. | |
| 3. AOI | The combination of 2D and 3D AOI inspection can detect various issues after mounting, such as short circuits, missing components, polarity errors, displacements, and incorrect parts. | |
| 4.X-RAY | The combination of 3D X-RAY inspection and 2D X-RAY sampling inspection is used to detect open circuits and short circuits in devices such as BGA and QFN. | |
PCB Design and Board Manufacturing Capabilities
| PCB design capability | Maximum number of layers: 40 | |
| Maximum number of designed PINs: 60,000 | ||
| Maximum connections: 40000 | ||
| Minimum mechanical aperture: 6mil | ||
| Minimum laser aperture: 4mil | ||
| Minimum line width: 3mil | ||
| Maximum BGA quantity on a single board: 40 | ||
| Minimum BGA pitch: 0.4mm | ||
| Maximum signal design rate: 28Gbps | ||
| PCB design type | Communication products: switches, routers, optical networks, VoIP, various types of communication boards (LTE terminals, 3G/4G, backbone access network transmission equipment), etc; | |
| Computer products: servers, laptops, tablet computers, ultrabooks, etc; | ||
| Transportation: in-vehicle multimedia systems, navigation devices, road surveillance equipment, etc; | ||
| Industrial embedded systems: ATCA, ETX, Utca, etc; | ||
| Digital consumption: GPS, smart wearables, e-books, smartphones, etc; | ||
| Medical instruments: detection and monitoring equipment, CT, ultrasound, and other equipment. | ||
| PCB production capacity | Number of producible layers | Floors 1-108 |
| Maximum processing size | 610mm×1200mm | |
| Produceable plate thickness | 0.2mm-13.0mm | |
| Capable of producing copper thickness | 0.5oz-12oz | |
| Minimum line width/line spacing | 2.5mil/3mil | |
| Minimum finished product aperture | 0.10mm | |
| Maximum thickness-to-diameter ratio | 32：1 | |
| Common board materials | FR4, HTG, PTFE, metal substrate, high-frequency material, high-speed material | |
| Special process for machining | Blind buried hole, in-plane hole, crimping hole, back drilling hole, half hole, tapered (stepped) hole, copper inlay, stepped gold finger, high-frequency board, high-speed board, hybrid board, rigid-flex board, thick copper board, busbar board, metal-based (core) board, ceramic substrate | |
AOI
| Model | VT-S1080 (3D AOI behind the furnace) | VT-S1040 (3D AOI behind the furnace) | VT-Z600 (2D AOI in front of the furnace) | |
| Appearance | 1180(W) x 1450(D) x 1500(H)mm (excluding the tower light and display parts.) | |||
| Weight | About 1240kg | |||
| Power Supply | AC 200~240V (single-phase), with a variation range of ±10%, and 50/60Hz | |||
| Rated power | 2.0kVA (Maximum current 10A) | |||
| Height of production line | 900±20mm | |||
| Pressure | Don't do it | |||
| Operating temperature range | 10 to 35℃ | |||
| Operating humidity range | 35-80% RH (no condensation) | |||
| Camera | Direct gaze | 12Mpix | ||
| strabismus | 5Mpix | - | - | |
| Resolving power | Direct gaze | 12.5μm | ||
| strabismus | 10μm | - | - | |
| FOV | Direct gaze | 50.0×37.5mm | ||
| strabismus | 25.9×19.4mm | - | - | |
| Principle of Inspection | MDMC illumination + phase shift (MPS) | MDMC illumination + phase shift (MPS)*8 | MDMC lighting | |
| Test circuit board | size | Single track: 50(W) x 50(D) ~ 510(W) x 680(D)mm. Double track: 50(W) x 50(D) ~ 510(W) x 330(D)mm | ||
| thickness | 0.4 to 4mm | |||
| weight | 4Kg | |||
| Clearance | Within 54mm above and 50mm below the surface of the conveyor belt (including the thickness, bending, and component tolerance of the circuit board) | |||
| Height measurement range | 25.4mm | - | ||
| Inspection items | Component height, component floating height, component tilt, missing parts, incorrect parts, polarity error, flipped parts, OCR detection, 2D code, component offset (X/Y/angle offset), tin climbing (tin climbing height, tin climbing length, end welding width, welding wetting angle, side welding length), pad exposure, foreign objects, pad abnormalities, electrode offset, electrode shape, presence of electrodes, solder beads, continuous solder, component distance, component angle | Missing parts, incorrect parts, polarity error, flipped parts, OCR inspection, 2D code, component offset (X/Y/angle offset), tin-climbing*9 (tin-climbing height, tin-climbing length, end welding width, welding wetting angle, side welding length), pad exposure, foreign object, pad abnormality, electrode offset, electrode shape, presence of electrode, solder bead, continuous solder, component distance, component angle | ||
X-ray
| Project | content | |
| Model | VT-X750 | |
| Type | V3-H | |
| Check the target component | BGA/CSP, interposer, SOP/QFP, transistor, R/C chip, bottom electrode component, QFN, power module, POP, press-fit connector, etc | |
| Inspection items | Bubbles, open welds, lack of wetting, amount of solder, offset, bridging, tin creep, through-hole solder filling, solder balls, etc. (Selectable based on the inspection object) | |
| Shooting specifications | Shooting method | Using multiple projection images for 3D tomographic imaging |
| Shooting resolution | You can select 6, 8, 10, 15, 20, 25, or 30µm/pixel based on the inspection object | |
| X-ray source | Micro-focusing closed tube | |
| X-ray detector | FPD | |
| Object substrate | Substrate size | 50×50 ~ 610×515mm, thickness: 0.4 ~ 5.0mm (0.4 ~ 3.0mm at a resolution of 3μm) |
| Substrate weight | Below 8.0kg | |
| warping | Below 2.0mm (Below 1.0mm at a resolution of 3μm) | |
| Device specifications | External dimensions | 1,550(W)×1,925(D)×1,645(H)mm (excluding protrusions, signal towers, and displays) |
| Device weight | About 3,100kg | |
| Handling height of substrate | 900 ±20mm | |
| supply voltage | Single-phase, AC 200 ~ 240V, 50/60Hz | |
| Rated power | 2.4kVA | |
| X-ray leakage | Below 0.5 μSv/h | |
| pressure | 0.4 to 0.6 MPa | |
| Corresponding standards | CE, SEMI, NFPA, FDA | |
Process
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