PCB Assembly Service
● 2260 square meters of SMT production workshop
● ISO9001 QUALITY MANAGEMENT SYSTEM
● ISO13485 QUALITY MANAGEMENT SYSTEM
● IATF16949 QUALITY MANAGEMENT SYSTEM
We have 5 SMT (Surface Mount Technology) production lines equipped with brand-new imported Samsung S1 and S2 high-speed placement machines, fully automatic solder paste printing machines, ERSA ten-temperature zone reflow ovens, AOI (Automated Optical Inspection), SPI (Surface Mount Inspection), X-RAY, and other high-end equipment. We are particularly skilled in producing high-precision and complex single boards, and have actual performance in producing ultra-complex single boards. We can mount SMD (Surface Mount Devices) components including 0201 and 01005, as well as ultra-high-precision QFP and BGA chips with a pin pitch of 0.3mm. For specific details, please refer to the "Professional PCBA" section mentioned above.
High-Precision PCBA Manufacturing & One-Stop Assembly Solutions in China
At Shenzhen Qingjian Electronic Technology Co., Ltd., we provide reliable, flexible, and high-precision PCB assembly services to global clients across the electronics industry. Whether you need rapid prototype assembly or small to medium volume production, our Shenzhen-based facility delivers turnkey quality with fast turnaround and full process traceability.
With over 15 years of EMS experience, we serve diverse industries such as automotive, medical, telecommunications, industrial automation, and more.
What is PCB Assembly?
PCB Assembly (PCBA) refers to the process of mounting and soldering electronic components onto bare printed circuit boards (PCBs), transforming a blank board into a functional electronic module. At Qingjian, we offer both SMT (Surface Mount Technology) and THT (Through-Hole Technology) assembly, backed by full inspection and testing services.
Our PCB Assembly Capabilities
SMT & THT Assembly
6 high-speed SMT lines (Samsung S1/S2 pick-and-place machines)
ERSA reflow & wave soldering systems
Support for 0201/01005 components, BGA, QFP (pitch down to 0.3mm)
Manual & selective soldering for THT components
Component Sourcing
We offer BOM-based component procurement with reliable sourcing channels to ensure timely, cost-effective assembly.
Prototype to Production
From 1–1000+ pcs, we support everything from engineering samples to small/medium production runs, with flexible order handling and rapid delivery.
Core Equipment & Technology
| Equipment | Function |
|---|---|
| GKG Automatic Solder Paste Printers | Accurate paste application |
| Samsung S1/S2 SMT Machines | High-speed component placement |
| ERSA Reflow & Wave Soldering | Precision soldering |
| Omron AOI (2D/3D) | Automated optical inspection |
| KY-8030 SPI | Real-time solder paste inspection |
| Blue Eye FAI System | First article verification |
| Omron X-Ray (3D-RAY) | BGA/QFN/QFP inspection |
PCBA Production Capacity
| Daily production capacity of SMT | 4 million points | |
| SMT production line | 5 items | |
| Material throwing rate | Specific resistance 0.3% | |
| IC type without material throwing | ||
| Single board type | POP/Regular Board/FPC/Rigid-Flex Board/Metal Substrate | |
| Specification of mounted components | Minimum package size for attachment | 01005 Chip/0.4 Pitch BGA |
| Minimum device precision | ±0.04mm | |
| IC-type chip placement accuracy | ±0.03mm | |
| Mounting PCB specifications | PCB size | 50*50mm - 610*510mm |
| PCB thickness | 0.3-6.5mm | |
| Process flow and capacity | 1. Hold an order review meeting before the product is launched to provide early warning of potential issues and propose solutions. | |
| 2. Evaluate the requirements for the development of steel mesh fixtures and implement reverse control to prevent supplier defects. | ||
| 3. The process engineer shall fully cooperate with production to address process anomalies. | ||
| 4. For unreasonable customer designs, we will provide a corresponding summary report of trial production issues to assist customers in optimizing their designs. | ||
| Quality control capability | 1. Intelligent first article inspection device | Detecting incorrect materials, missing parts, polarity, direction, silk-screening, etc., it is primarily applied to the inspection of the first piece. Compared to manual inspection, it offers higher accuracy and a speed increase of over 50%. |
| 2.SPI-Fully automatic 3D solder paste thickness gauge | Detect various quality issues in solder paste printing, such as missing printing, insufficient solder, excessive solder, continuous solder, misalignment, poor shape, and board surface contamination. | |
| 3. AOI | The combination of 2D and 3D AOI inspection can detect various issues after mounting, such as short circuits, missing components, polarity errors, displacements, and incorrect parts. | |
| 4.X-RAY | The combination of 3D X-RAY inspection and 2D X-RAY sampling inspection is used to detect open circuits and short circuits in devices such as BGA and QFN. | |
PCB Design and Board Manufacturing Capabilities
| PCB design capability | Maximum number of layers: 40 | |
| Maximum number of designed PINs: 60,000 | ||
| Maximum connections: 40000 | ||
| Minimum mechanical aperture: 6mil | ||
| Minimum laser aperture: 4mil | ||
| Minimum line width: 3mil | ||
| Maximum BGA quantity on a single board: 40 | ||
| Minimum BGA pitch: 0.4mm | ||
| Maximum signal design rate: 28Gbps | ||
| PCB design type | Communication products: switches, routers, optical networks, VoIP, various types of communication boards (LTE terminals, 3G/4G, backbone access network transmission equipment), etc; | |
| Computer products: servers, laptops, tablet computers, ultrabooks, etc; | ||
| Transportation: in-vehicle multimedia systems, navigation devices, road surveillance equipment, etc; | ||
| Industrial embedded systems: ATCA, ETX, Utca, etc; | ||
| Digital consumption: GPS, smart wearables, e-books, smartphones, etc; | ||
| Medical instruments: detection and monitoring equipment, CT, ultrasound, and other equipment. | ||
| PCB production capacity | Number of producible layers | Floors 1-108 |
| Maximum processing size | 610mm×1200mm | |
| Produceable plate thickness | 0.2mm-13.0mm | |
| Capable of producing copper thickness | 0.5oz-12oz | |
| Minimum line width/line spacing | 2.5mil/3mil | |
| Minimum finished product aperture | 0.10mm | |
| Maximum thickness-to-diameter ratio | 32：1 | |
| Common board materials | FR4, HTG, PTFE, metal substrate, high-frequency material, high-speed material | |
| Special process for machining | Blind buried hole, in-plane hole, crimping hole, back drilling hole, half hole, tapered (stepped) hole, copper inlay, stepped gold finger, high-frequency board, high-speed board, hybrid board, rigid-flex board, thick copper board, busbar board, metal-based (core) board, ceramic substrate | |
AOI
| Model | VT-S1080 (3D AOI behind the furnace) | VT-S1040 (3D AOI behind the furnace) | VT-Z600 (2D AOI in front of the furnace) | |
| Appearance | 1180(W) x 1450(D) x 1500(H)mm (excluding the tower light and display parts.) | |||
| Weight | About 1240kg | |||
| Power Supply | AC 200~240V (single-phase), with a variation range of ±10%, and 50/60Hz | |||
| Rated power | 2.0kVA (Maximum current 10A) | |||
| Height of production line | 900±20mm | |||
| Pressure | Don't do it | |||
| Operating temperature range | 10 to 35℃ | |||
| Operating humidity range | 35-80% RH (no condensation) | |||
| Camera | Direct gaze | 12Mpix | ||
| strabismus | 5Mpix | - | - | |
| Resolving power | Direct gaze | 12.5μm | ||
| strabismus | 10μm | - | - | |
| FOV | Direct gaze | 50.0×37.5mm | ||
| strabismus | 25.9×19.4mm | - | - | |
| Principle of Inspection | MDMC illumination + phase shift (MPS) | MDMC illumination + phase shift (MPS)*8 | MDMC lighting | |
| Test circuit board | size | Single track: 50(W) x 50(D) ~ 510(W) x 680(D)mm. Double track: 50(W) x 50(D) ~ 510(W) x 330(D)mm | ||
| thickness | 0.4 to 4mm | |||
| weight | 4Kg | |||
| Clearance | Within 54mm above and 50mm below the surface of the conveyor belt (including the thickness, bending, and component tolerance of the circuit board) | |||
| Height measurement range | 25.4mm | - | ||
| Inspection items | Component height, component floating height, component tilt, missing parts, incorrect parts, polarity error, flipped parts, OCR detection, 2D code, component offset (X/Y/angle offset), tin climbing (tin climbing height, tin climbing length, end welding width, welding wetting angle, side welding length), pad exposure, foreign objects, pad abnormalities, electrode offset, electrode shape, presence of electrodes, solder beads, continuous solder, component distance, component angle | Missing parts, incorrect parts, polarity error, flipped parts, OCR inspection, 2D code, component offset (X/Y/angle offset), tin-climbing*9 (tin-climbing height, tin-climbing length, end welding width, welding wetting angle, side welding length), pad exposure, foreign object, pad abnormality, electrode offset, electrode shape, presence of electrode, solder bead, continuous solder, component distance, component angle | ||
X-ray
| Project | content | |
| Model | VT-X750 | |
| Type | V3-H | |
| Check the target component | BGA/CSP, interposer, SOP/QFP, transistor, R/C chip, bottom electrode component, QFN, power module, POP, press-fit connector, etc | |
| Inspection items | Bubbles, open welds, lack of wetting, amount of solder, offset, bridging, tin creep, through-hole solder filling, solder balls, etc. (Selectable based on the inspection object) | |
| Shooting specifications | Shooting method | Using multiple projection images for 3D tomographic imaging |
| Shooting resolution | You can select 6, 8, 10, 15, 20, 25, or 30µm/pixel based on the inspection object | |
| X-ray source | Micro-focusing closed tube | |
| X-ray detector | FPD | |
| Object substrate | Substrate size | 50×50 ~ 610×515mm, thickness: 0.4 ~ 5.0mm (0.4 ~ 3.0mm at a resolution of 3μm) |
| Substrate weight | Below 8.0kg | |
| warping | Below 2.0mm (Below 1.0mm at a resolution of 3μm) | |
| Device specifications | External dimensions | 1,550(W)×1,925(D)×1,645(H)mm (excluding protrusions, signal towers, and displays) |
| Device weight | About 3,100kg | |
| Handling height of substrate | 900 ±20mm | |
| supply voltage | Single-phase, AC 200 ~ 240V, 50/60Hz | |
| Rated power | 2.4kVA | |
| X-ray leakage | Below 0.5 μSv/h | |
| pressure | 0.4 to 0.6 MPa | |
| Corresponding standards | CE, SEMI, NFPA, FDA | |
Process
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